The YCS 2020 desoldering wick is a 2.0mm wide, 2.0m long pure copper solder wick built for mobile phone motherboard and PCB repair work. Made with an ultra-soft copper braid and a low-residue rosin flux core, it lifts excess solder cleanly without damaging pads or nearby components. Technicians use it for IC removal prep, board cleaning, and general de-tinning on smartphone and laptop boards. The 5-piece roll pack keeps your repair bench stocked for daily desoldering jobs, from dead phone diagnostics to full board-level rework.
